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TC1267
400mA PCI LDO
Features
* * * * * * * * Glitch Free Transition Between Input Sources Automatic Input Source Selection External PMOS Bypass Switch Control Built-in 5V Detector 1% Regulated Output Voltage Accuracy 400mA Load Current Capability Kelvin Sense Input Low Ground Current, Independent of Load
General Description
The TC1267 is an application-specific, low dropout regulator (LDO), specifically intended for use in PCI peripheral card applications complying with PCI Power Management (PCI 2.0). It provides an uninterrupted, 3.3V output voltage when the main (5V) or auxiliary (3.3V) input voltage supplies are present. The TC1267 consists of an LDO, a voltage threshold detector, external switchover logic and gate drive circuitry. It functions as a conventional LDO as long as the voltage on the main supply input (VIN) is above the lower threshold (3.90V typical). Should the voltage on VIN fall below the lower threshold, the LDO is disabled and an external P-channel MOSFET is automatically turned on, connecting the auxiliary supply input to VOUT, and ensuring an uninterrupted 3.3V output. The main supply is automatically selected, if both the main and auxiliary input supplies are present, and transition from one input supply to the other is ensured glitchfree. High integration, automatic secondary supply switchover, Kelvin sensing, and small size make the TC1267 the optimum LDO for PCI 2.0 applications.
Applications
* * * * * PCMCIA PCI Network Interface Cards (NICs) CardbusTM Technology Desktop Computers
Device Selection Table
Part Number TC1267VET Package 5-Pin DDPAK Junction Temp. Range -5C to +95C
Functional Block Diagram
Pin Configuration
5-Pin DDPAK
Tab is GND
VIN VAUX Detect DR
Bandgap Reference
TC1267
- E/A + GND
VOUT
1 2345 VAUX VIN GND VOUT DR
2002 Microchip Technology Inc.
DS21378B-page 1
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TC1267
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Supply Voltage (VIN).............. -0.5V to +7V (Max) Auxiliary Supply Voltage (VAUX) ..... -0.5V to +7V (Max) LDO Output Current (IOUT)................................ 400mA Thermal Impedance, Junction-to-Ambient (JA).......... 27C/W for DDPAK ESD Rating .......................................................... 2 KV Operating Temperature Range (TA)........ -5C to +70C Storage Temperature Range (TSTG) ...-65C to +150C
TC1267 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7F, unless otherwise noted. Boldface type specifications apply over full operating range. Symbol VIN IGND IVIN VAUX IQ(AUX) Parameter Supply Voltage Ground Current Reverse Leakage from VAUX Supply Voltage Quiescent Current Min 4.4 -- -- -- 3.0 -- -- -- -- IVAUX VTH(LO) VHYST VTH(HI) VOUT Reverse Leakage from VIN 5V Detector Low Threshold Voltage 5V Detector Hysteresis Voltage 5V Detector High Threshold Voltage LDO Output Voltage -- -- 3.75 -- 200 -- 4.0 -- 3.201 3.000 IOUT REG(LINE) REG(LOAD) VDR Output Current Line Regulation Load Regulation Drive Voltage 400 -- -0.5 -- -1.5 VIN - 0.2 VIN - 0.3 -- --
Note 1: 2: 3: 4: 5: 6:
Typ 5.0 230 260 -0.1 3.3 50 -- 60 -- -0.1 3.90 -- 260 -- 4.15 -- 3.300 -- -- -- 0.05 -- -0.1 -- VIN - 0.1 -- 35 --
Max 5.5 450 500 -1.0 3.6 70 100 80 120 -1.0 -- 4.05 -- 300 -- 4.30 -- 3.366 -- -- -- +0.5 -- +0.5 -- -- 150 200
Units V A A V A A A V mV V V V V mA % % V mV VAUX = 0V
Test Conditions VAUX = 0V (Note 6) VAUX = 3.3V (Note 6) VAUX = 3.5V, VIN = 0V, IOUT = 0mA
VIN = 0V, IOUT = 0mA VIN = 5V, IOUT = 0mA VIN = 5.5V, VAUX = 0V, IOUT = 0mA VIN Falling (Notes 2, 3) (Notes 2, 3) VIN Rising (Notes 2, 3) IOUT = 20mA 4.4V VIN 5.5V, 0mA IOUT 400mA 0mA IOUT 400mA (Note 4) VIN = 4.3V to 5.5V IOUT = 0.1mA to 400mA 4.3V VIN 5.5V, IDR = 200A VIN < VTH(LO), IDR = 200A
Ensured by design. See 5V Detect Thresholds, Figure 4-1. Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST , thus avoiding DR toggling during 5V detect threshold transitions. In Application Circuit, Figure 3-1. See Timing Diagram, Figure 4-2. Ground Current is independent of ILOAD.
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TC1267
TC1267 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = +25C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7F, unless otherwise noted. Boldface type specifications apply over full operating range. Symbol IDR(PK) tDH tDL
Note 1: 2: 3: 4: 5: 6:
Parameter Peak Drive Current Drive High Delay (Notes 1, 5) Drive Low Delay (Notes 1, 5)
Min 7 6 -- -- -- --
Typ -- -- 4 -- 0.6 --
Max -- -- -- 8 1.5 3.0
Units mA sec sec
Test Conditions Sinking: VIN = 3.75V, VDR = 1V; Sourcing: VIN = 4.3V, VIN - VOR = 2V CDR = 1.2nF, VIN ramping up, measured from VIN = VTH(HI) to VDR = 2V CDR = 1.2nF, VIN ramping down, measured from VIN = VTH(LO) to VDR = 2V
Ensured by design. See 5V Detect Thresholds, Figure 4-1. Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST , thus avoiding DR toggling during 5V detect threshold transitions. In Application Circuit, Figure 3-1. See Timing Diagram, Figure 4-2. Ground Current is independent of ILOAD.
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DS21378B-page 3
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TC1267
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. 1 2 3 4 5
PIN FUNCTION TABLE
Symbol VAUX VIN GND VOUT DR Auxiliary input supply, nominally 3.3V. Main input supply for the TC1267, nominally 5V. Logic and power ground. LDO 3.3V output. Driver output for external P-channel MOSFET pass element. Description
3.0
DETAILED DESCRIPTION
APPLICATION CIRCUIT
Q1 TAB IS GND
FIGURE 3-1:
TC1267
VAUX
3.3V 5V C1 4.7F C2 0.1F C3 0.1F C4 4.7F C5 0.1F 3.3V
DS21378B-page 4
NOTE: External switch (Q1): use Motorola MGSF1P02ELT1 or equivalent (PMOS, typical Gate Threshold Voltage = 1V, typical RDS(ON) = 0.4 at VGS = 2.5V)
GND VOUT DR
VIN
2002 Microchip Technology Inc.
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TC1267
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 5V 5% VOUTMIN = 3.217V ILOADMAX = 400mA TJMAX TAMAX JA = 95C = 70C = 27C/W (DDPAK mounted on 1000 sq mm topside copper area)
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
4.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = (5.25V - 3.217V) 400mA = 813mW Maximum allowable power dissipation: PDMAX = (T JMAX - TAMAX) JA = (95 - 70) 27 = 423mW In this example, the TC1267 dissipates a maximum of 813mW; below the allowable limit of 926mW.
EQUATION 4-1:
PD (VINMAX - VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA).
EQUATION 4-2:
PDMAX = (TJMAX - TAMAX) JA Where all terms are previously defined. Table 4-1 shows various values of JA for the TC1267 packages.
TABLE 4-1:
THERMAL RESISTANCE GUIDELINES FOR TC1267 IN 5-PIN DDPAK
Copper Area (Backside) Board Area Thermal Resistance (JA) 25C/W 27C/W 35C/W
Copper Area (Topside)*
2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 125 sq mm 2500 sq mm 2500 sq mm
*Tab of device attached to topside copper.
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DS21378B-page 5
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TC1267
FIGURE 4-1: 5V DETECT THRESHOLD
4.4V VHYST VIN VTH(HI) VTH(LO) 3.65V
DR
2.0V
2.0V
NOTE: VIN rise and fall times (10% to 90%) to be 100sec.
FIGURE 4-2:
TIMING DIAGRAM
4.4V
VIN
3.65V tDH tDL
DR 2.0V 2.0V
NOTE: VIN rise and fall times (10% to 90%) to be 0.1sec.
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TC1267
5.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
IQ vs. VIN vs. Junction Temperature
0.45 0.40 0.35 0.30 IQ (mA) 0.25 0.20 0.15 0.10 0.05 0.00 0 1 2 3 VIN (V) 4 5 6 +25C -5C IO = 0.1mA VAUX = 0V +125C
IQ vs. VIN vs. Junction Temperature
0.45 0.40 0.35 0.30 IQ (mA) 0.25 0.20 0.15 0.10 0.05 0.00 0 1 2 3 VIN (V) 4 5 6 -5C +25C IO = 0.1mA VAUX = 3.3V +125C
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35 0.30 IQ (Aux) (mA) 0.25 IQ (Aux) (mA) 0.20 0.15 0.10 0.05 0.00 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VAUX (V) 3 3.3 3.6 +25C +125C -5C IO = 0mA VAUX = 0V
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35 0.30 0.25 -5C 0.20 0.15 0.10 0.05 0.00 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VAUX (V) 3 3.3 3.6 +125C +25C IO = 0mA VAUX = 5V
LDO Output Voltage vs. Junction Temperature
3.34 3.33 3.32 VOUT (V) 3.31 3.30 3.29 3.28 3.27 3.26 -50 -25 0 25 50 75 100 125 JUNCTION TEMPERATURE C IO = 200mA VIN = 5V
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TC1267
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
Drive High Delay Drive Low Delay
VIN steps from 0.8V to 5V
See application circuit on Page 5 ILOAD = 200mA
Trace 1: VIN stepping for 0.8V to 5V Trace 2: DR TH(HI) TDH = < 4 S
Trace 1: VIN stepping for 5.5V to 0V
R
TDL = < 600nS
VO (min) with VIN Rising
VO (min) with VIN Falling
Notice no voltage spikes during transition from VAUX to LDO output
VOUT voltage difference is IOUT x RDS(ON) and variations between VAUX supply and LDO output voltage
VOUT voltage difference is IOUT x RDS(ON) + voltage difference from LDO to VAUX supply
Trace 1: VIN - 3A charging a 1500F capacitor Trace 2: DR going high at VTH(HI) Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.24V ILOAD = 200A
Trace 1: VIN - discharging a 1500F capacitor Trace 2: DR going low at VTH(LO) Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.14V ILOAD = 200A
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2002 Microchip Technology Inc.
TC1267
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 5-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device Marking
W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
5-Pin DDPAK
24 mm
16 mm
750
13 in
6.3
Package Dimensions
5-Pin DDPAK
.410 (10.41) .385 (9.78) .067 (1.70) .045 (1.14) 3 - 7 (5x) .370 (9.40) .330 (8.38) .605 (15.37) .549 (13.95) .026 (0.66) .014 (0.36) .037 (0.94) .026 (0.66) .067 (1.70) TYP. 8 MAX. Dimensions: inches (mm) .110 (2.79) .068 (1.72) .010 (0.25) .000 (0.00) .183 (4.65) .170 (4.32) .055 (1.40) .045 (1.14)
PIN 1
2002 Microchip Technology Inc.
DS21378B-page 9
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TC1267
NOTES:
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TC1267
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21378B-page 11
TC1267
NOTES:
DS21378B-page 12
2002 Microchip Technology Inc.
TC1267
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
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2002 Microchip Technology Inc.
DS21378B-page 13
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2002 Microchip Technology Inc.
*B87312SD*

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